The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

May. 30, 2006
Applicants:

Carl Hayton, Cambridge, GB;

Thomas Meredith Brown, Rome, IT;

Paul A. Cain, Cambridge, GB;

Inventors:

Carl Hayton, Cambridge, GB;

Thomas Meredith Brown, Rome, IT;

Paul A. Cain, Cambridge, GB;

Assignee:

FLEXENABLE LIMITED, Cambridge, Cambridgeshire, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/44 (2006.01); H01L 51/40 (2006.01); H01L 51/00 (2006.01); H01L 21/268 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); B23K 26/06 (2014.01); B23K 26/40 (2014.01); H01L 51/10 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0023 (2013.01); B23K 26/063 (2013.01); B23K 26/409 (2013.01); H01L 21/02675 (2013.01); H01L 21/268 (2013.01); H01L 21/76894 (2013.01); H01L 51/102 (2013.01); H01L 27/1214 (2013.01); H01L 29/78681 (2013.01); H01L 51/0017 (2013.01); H01L 51/0021 (2013.01); H01L 51/055 (2013.01); H01L 51/0545 (2013.01);
Abstract

A method of fabricating an organic electronic device is provided. The organic electronic device has a structure including an upper conductive layer and an underlying layer immediately beneath said upper conducting layer and having at least one solution process able semiconducting layer. The upper conducting layer preferably has a thickness of between 10 nm and 200 nm. The method includes patterning said upper conductive layer of said structure by: laser ablating said upper conductive layer using a pulsed laser to remove regions of upper conductive layer from said underlying layer for said patterning; and wherein said laser ablating uses a single pulse of said laser to substantially completely remove a said region of said upper conductive layer to expose said underlying layer beneath.


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