The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Mar. 24, 2014
Applicant:

Osram Opto Semiconductor Gmbh, Regensburg, DE;

Inventors:

Karl Weidner, München, DE;

Ralph Wirth, Lappersdorf, DE;

Axel Kaltenbacher, Ingolstadt, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Oliver Wutz, Regensburg, DE;

Jan Marfeld, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 31/0232 (2014.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 31/0232 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body, at least one plated-through hole including an electrically conductive material, and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein, the plated-through hole is arranged in a manner laterally spaced apart from the semiconductor chip, the plated-through hole completely penetrates through the shaped body, and the plated-through hole extends from a top side of the shaped body to an underside of the shaped body, the electrically conductive connection extends at the top side of the shaped body.


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