The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Dec. 01, 2011
Applicants:

Haizhou Yin, Poughkeepsie, NY (US);

Jing Xu, Beijing, CN;

Yunfei Liu, Beijing, CN;

Inventors:

Haizhou Yin, Poughkeepsie, NY (US);

Jing Xu, Beijing, CN;

Yunfei Liu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 21/285 (2006.01); H01L 21/324 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/665 (2013.01); H01L 21/28518 (2013.01); H01L 21/324 (2013.01); H01L 29/458 (2013.01); H01L 29/66772 (2013.01); H01L 29/78603 (2013.01); H01L 29/78618 (2013.01);
Abstract

A method for manufacturing a semiconductor structure comprises following steps: providing an SOI substrate, forming a gate stack on the SOI substrate, forming sidewall spacers on sidewalls of the gate stack, and forming source/drain regions on each side of the gate stack; depositing a first metal layer on surfaces of an entire semiconductor structure, and then removing the first metal layer; forming an amorphous semiconductor layer on surfaces of the source/drain regions; depositing a second metal layer on surfaces of the entire semiconductor structure, and then removing the second metal layer; and annealing the semiconductor structure. Accordingly, the present invention further provides a semiconductor structure. The present invention is capable of effectively reducing contact resistance at source/drain regions.


Find Patent Forward Citations

Loading…