The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Jan. 12, 2015
Applicant:

Stanley Electric Co., Ltd., Meguro-ku, Tokyo, JP;

Inventors:

Ryosuke Kawai, Yokohama, JP;

Tatsuma Saito, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/38 (2010.01); H01L 33/08 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 51/52 (2006.01); H05B 33/08 (2006.01); H01L 33/40 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); H01L 25/0753 (2013.01); H01L 33/08 (2013.01); H01L 33/387 (2013.01); H01L 33/62 (2013.01); H01L 33/382 (2013.01); H01L 33/40 (2013.01); H01L 33/44 (2013.01); H01L 51/5284 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12041 (2013.01); H05B 33/0803 (2013.01);
Abstract

A semiconductor light-emitting device comprises: a mounting substrate; a plurality of semiconductor light-emitting elements that are arranged on the mounting substrate; a light absorber that is formed so as to cover an entire region between the plurality of semiconductor light-emitting elements adjacent to each other on the mounting substrate; and a wiring group including a plurality of wirings wired to each of the plurality of semiconductor light-emitting elements.


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