The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Feb. 01, 2013
Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

Thomas M. Goida, Windham, NH (US);

Xiaojie Xue, Bedford, MA (US);

Assignee:

ANALOG DEVICES, INC., Norwood, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/04 (2006.01); H01L 23/00 (2006.01); G01P 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/04 (2013.01); H01L 24/03 (2013.01); G01P 1/023 (2013.01); H01L 2924/1461 (2013.01);
Abstract

Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.


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