The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Jun. 05, 2014
Infineon Technologies Ag, Neubiberg, DE;
Alexander Komposch, Morgan Hill, CA (US);
Soon Ing Chew, Milpitas, CA (US);
Herman Hugo, San Jose, CA (US);
Simon Ward, Morgan Hill, CA (US);
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device package includes a solid metal base with a top surface and an electrically conductive chip mounting area on the top surface. First and second pairs of conductive leads are attached to the base and extend away from one another in opposite directions. First and second amplifiers are attached to the top surface and are electrically connected to the first and second pairs of leads. The first pair is separated from the second pair by a horizontal gap between inner edge sides of the leads. A reference line in the horizontal gap that extends perpendicular to edges of the base divides the chip mounting area into first and second chip mounting sections. An area of the first chip mounting section is smaller than an area of the second chip mounting section. The first and second leads have a smaller width than the third and fourth leads.