The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Sep. 10, 2014
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Yoshiaki Goto, Kiyosu, JP;
Takashi Imoto, Kamakura, JP;
Takeshi Watanabe, Yokkaichi, JP;
Yuusuke Takano, Yokkaichi, JP;
Yusuke Akada, Mie, JP;
Yuji Karakane, Nagoya, JP;
Yoshinori Okayama, Yokohama, JP;
Akihiko Yanagida, Zama, JP;
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Abstract
In a manufacturing method of a semiconductor device according to an embodiment, a plurality of semiconductor packages each including a semiconductor chip mounted on a wiring board and a sealing resin layer as objects to be processed, and a tray including a plurality of housing parts are prepared. A depressed portion having a non-penetrating shape or a penetrating shape is formed in the housing part. The semiconductor packages are disposed in the plural housing parts respectively. By sputtering a metal material on the semiconductor package housed in the tray, a conductive shield layer is formed.