The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Dec. 01, 2011
Applicants:

Ryoichi Kajiwara, Hitachi, JP;

Shigehisa Motowaki, Mito, JP;

Yusuke Asaumi, Hitachi, JP;

Inventors:

Ryoichi Kajiwara, Hitachi, JP;

Shigehisa Motowaki, Mito, JP;

Yusuke Asaumi, Hitachi, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/049 (2006.01); H01L 23/24 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/049 (2013.01); H01L 23/24 (2013.01); H01L 23/296 (2013.01); H01L 23/3735 (2013.01); H01L 23/3142 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); Y10T 428/12458 (2015.01); Y10T 428/12472 (2015.01);
Abstract

Provided are a metal-resin composite having excellent adhesive strength, a method for producing the same, a busbar, a module case, and a resinous connector part. The metal-resin composite comprises a metallic memberincluding a metal with a high melting point of 500° C. or more, a resin memberbeing integrated with the metallic member; and an alloy layerincluding a metal with a low melting point lower than 500° C. The alloy layeris arranged between the metallic memberand the resin member, and has average surface roughness thereof in the range from 5 nm or more to less than 1 μm at the interface between the alloy layerand the resin member. Herein, a period of the unevenness formed on the interface of the alloy layeris in the range from 5 nm or more to less than 1 μm.


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