The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Sep. 05, 2013
Applicant:

Diftek Lasers, Inc., Waterloo, CA;

Inventor:

Douglas R. Dykaar, Waterloo, CA;

Assignee:

DIFTEK LASERS, INC., Waterloo, Ontario, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02422 (2013.01); H01L 21/56 (2013.01); H01L 21/67011 (2013.01); H01L 21/67092 (2013.01); H01L 21/84 (2013.01); H01L 23/28 (2013.01); H01L 24/11 (2013.01); H01L 2924/15788 (2013.01);
Abstract

Methods and systems to manufacture a semi-conducting backplane are described. According to one set of implementations, semi-conducting particles are positioned in a supporting material of the semi-conducting backplane utilizing perforations in the supporting material or perforations in a removable support member upon which the semi-conducting backplane is constructed. For example, semi-conducting particles are deposited in perforations on a supporting member such that a portion of the semi-conducting particles protrudes from the supporting member. Suction is applied to the semi-conducting particles to retain the semi-conducting particles in the perforations and a layer of encapsulant material is applied onto the supporting member to cover the protruding portion. The supporting member is then removed from the semi-conducting particles and the layer of encapsulant material, which together form an assembly of the semi-conducting particles and the layer of encapsulant material. The portion of the semi-conducting particles is then planarized.


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