The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Nov. 10, 2011
Applicants:

Kayoko Kawata, Tokyo, JP;

Yuko Yamamoto, Tokyo, JP;

Masaaki Kurokawa, Tokyo, JP;

Masaharu Michihashi, Tokyo, JP;

Naoto Kawase, Tokyo, JP;

Inventors:

Kayoko Kawata, Tokyo, JP;

Yuko Yamamoto, Tokyo, JP;

Masaaki Kurokawa, Tokyo, JP;

Masaharu Michihashi, Tokyo, JP;

Naoto Kawase, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/02 (2006.01); G01N 27/90 (2006.01); G01N 17/00 (2006.01); G01B 7/06 (2006.01); F22B 37/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/9046 (2013.01); F22B 37/003 (2013.01); G01B 7/105 (2013.01); G01N 17/008 (2013.01); G01N 27/90 (2013.01);
Abstract

An object is to improve the precision of estimating a blockage ratio or a deposited-scale thickness. In a deposit measurement apparatus that estimates a blockage ratio of a gap between a wall surface of a through-hole and an outer surface of a heat-conducting pipe or the thickness of a deposit deposited at the gap, an eddy-current flaw detection probe () acquires an eddy-current flaw detection signal by scanning inside the heat-conducting pipe with a sensor; and a processing device () estimates the blockage ratio at the gap or the thickness of the deposit deposited at the gap by using the eddy-current flaw detection signal for the gap of the pipe-supporting-plate protrusion in the through-hole.


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