The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Dec. 17, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Yusuke Matsuzawa, Chino, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 7/08 (2006.01); H01L 27/07 (2006.01); H01L 41/04 (2006.01); G01C 5/06 (2006.01); G01C 21/28 (2006.01);
U.S. Cl.
CPC ...
G01L 7/082 (2013.01); G01C 5/06 (2013.01); G01C 21/28 (2013.01); H01L 27/07 (2013.01); H01L 41/042 (2013.01);
Abstract
A physical quantity sensor includes a semiconductor substrate, a diaphragm section that is disposed on the semiconductor substrate and is flexurally deformed when receiving pressure, a sensor element that is disposed on the diaphragm section, an element-periphery structure member that is disposed on one surface side of the semiconductor substrate and forms a cavity section together with the diaphragm section, and a semiconductor circuit that is provided on the same surface side as the element-periphery structure member of the semiconductor substrate.