The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Aug. 19, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Tymon Barwicz, Yorktown Heights, NY (US);
Paul F. Fortier, Richelieu, CA;
Stephane G. Harel, Grandby, CA;
Yurii A. Vlasov, Katonah, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); F21V 21/00 (2006.01);
U.S. Cl.
CPC ...
F21V 21/00 (2013.01); G02B 6/4202 (2013.01); G02B 6/424 (2013.01);
Abstract
A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.