The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Mar. 25, 2014
Applicant:

Daido Metal Company Ltd., Nagoya-shi, Aichi-ken, JP;

Inventors:

Hiroyuki Asakura, Inuyama, JP;

Mikihito Yasui, Inuyama, JP;

Shigeya Haneda, Inuyama, JP;

Assignee:

DAIDO METAL COMPANY LTD., Nagoya-Shi, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); F16C 33/24 (2006.01); F16C 33/12 (2006.01); C23C 8/42 (2006.01); C23C 28/04 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
F16C 33/24 (2013.01); C23C 8/42 (2013.01); C23C 28/044 (2013.01); C23C 28/048 (2013.01); C23C 28/321 (2013.01); C23C 28/345 (2013.01); C23C 28/347 (2013.01); C23C 28/36 (2013.01); F16C 33/124 (2013.01); F16C 2204/36 (2013.01);
Abstract

A slide member provided with an overlay composed of a Bi-based material. A slide member includes a substrate; and an overlay including Bi or a Bi alloy provided over the substrate. A surface portion (surface-most portion) of the overlay includes an oxide layer in which a bismuth oxide, is scattered. The content of the bismuth oxide in the oxide layer represented by oxygen content is equal to or greater than 0.5% mass % and equal to or less than 8.0 mass %. The orientation intensity ratio of the main orientation plane of Bi or Bi alloy crystals in the overlay is 50% or greater. The main orientation plane of the bismuth oxide crystals in the oxide layer is the (220) plane or the (201) plane.


Find Patent Forward Citations

Loading…