The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Jun. 21, 2012
Applicants:

Hanh D. Nguyen, San Jose, CA (US);

Majeed A. Foad, Sunnyvale, CA (US);

Dieter Haas, San Jose, CA (US);

Karl J. Armstrong, San Jose, CA (US);

Xiaoxiong Yuan, San Jose, CA (US);

Inventors:

Hanh D. Nguyen, San Jose, CA (US);

Majeed A. Foad, Sunnyvale, CA (US);

Dieter Haas, San Jose, CA (US);

Karl J. Armstrong, San Jose, CA (US);

Xiaoxiong Yuan, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); F17D 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/455 (2013.01); C23C 16/45565 (2013.01); F17D 1/00 (2013.01); Y10T 137/8593 (2015.04);
Abstract

In some embodiments, a gas distribution system may include a body disposed within a through hole formed in a process chamber body, the body comprising an opening, wherein an outer surface of the body is disposed a first distance from an inner surface of the through hole to form a first gap; a flange disposed proximate a first end of the body, the flange having an outer dimension greater than an inner dimension of the through hole; a showerhead disposed proximate a second end of the body opposite the first end and extending outwardly from the body to overlap a portion of the process chamber body, the showerhead configured to allow a flow of gas to an inner volume of the process chamber, wherein an outer surface of the showerhead is disposed a second distance from an inner surface of the process chamber body to form a second gap.


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