The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Mar. 19, 2014
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Tsuneki Wakita, Otake, JP;
Keiji Nakamura, Otake, JP;
Hideaki Makino, Toyohashi, JP;
Masahiro Osuka, Kawasaki, JP;
Yohei Miwa, Toyohashi, JP;
Yasutaka Doi, Toyohashi, JP;
MITSUBISHI RAYON CO., LTD., Tokyo, JP;
Abstract
A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.