The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Jul. 18, 2013
Applicant:

Mikro Systems, Inc., Charlottesville, VA (US);

Inventors:

Michael Appleby, Crozet, VA (US);

Iain Fraser, Ruckersville, VA (US);

John Paulus, Afton, VA (US);

Assignee:

Mikro Systems, Inc., Charlottesville, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); B22C 9/04 (2006.01); B23P 15/24 (2006.01); B29C 33/30 (2006.01); B29C 33/38 (2006.01); C08L 83/04 (2006.01); A61B 6/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B22C 9/04 (2013.01); B23P 15/246 (2013.01); B29C 33/301 (2013.01); B29C 33/38 (2013.01); B29C 33/3835 (2013.01); C08L 83/04 (2013.01); A61B 6/4258 (2013.01); Y10T 428/24479 (2015.01);
Abstract

Certain exemplary embodiments can provide a composition, system, machine, device, manufacture, circuit, and/or user interface adapted for, and/or a method and/or machine-readable medium comprising machine-implementable instructions for, activities that can comprise, after removing a cast device from a stack-lamination-derived mold, said cast device formed from a molding composition, applying a desired shape to said cast device to form a shaped cast device, said molding composition comprising: a ceramic composition comprising silica; an cycloaliphatic epoxy binder composition, said cycloaliphatic epoxy binder composition present in said molding composition in an amount up to 30% by weight of said molding composition; a silicone composition comprising a siloxane resin, said silicone composition present in said molding composition in an amount up to 30% by weight of said molding composition; and a solvent composition adapted to dissolve said cycloaliphatic epoxy binder composition and said silicone composition.


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