The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Oct. 21, 2013
Applicants:
Heiko Stahl, Reutlingen, DE;
Christoph Duenn, Reutlingen, DE;
Hans-peter Baer, Pfullingen, DE;
Inventors:
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0006 (2013.01);
Abstract
A micromechanical component includes a substrate and a first oxide layer on the substrate, the first oxide layer having an aperture. The component further includes a conductive functional layer, which is provided on the first oxide layer in the region of the aperture, and a metal layer, which is provided on the functional layer, for producing a bond joint. A second oxide layer is provided on lateral faces of the functional layer for insulating the functional layer.
Stahl, Heiko. (2015). Micromechanical component having a bond joint (U.S. Patent No. 9206034). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9206034
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile