The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Oct. 19, 2010
Katsuhiro Muramoto, Kanagawa, JP;
Yuhei Yonekawa, Kanagawa, JP;
Daisuke Tsuchimoto, Kanagawa, JP;
Toshio Akimoto, Saitama, JP;
Kouhei Sasaki, Chiba, JP;
Katsuhiro Muramoto, Kanagawa, JP;
Yuhei Yonekawa, Kanagawa, JP;
Daisuke Tsuchimoto, Kanagawa, JP;
Toshio Akimoto, Saitama, JP;
Kouhei Sasaki, Chiba, JP;
DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD., Tokyo, JP;
JAPAN CROWN CORK CO., LTD., Tokyo, JP;
Abstract
The present invention provides a moisture-absorbing resin composition comprising resin (A) in an amount of 100 parts by mass, and zeolite in an amount of 40 to 300 parts by mass, wherein resin (A) contains at least one polymer selected from among ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, copolymer of ethylene-ethyl acrylate and acrylonitrile-styrene, and copolymer of ethylene-ethyl acrylate, maleic anhydride, and acrylonitrile-styrene, and a molded product produced through molding of the moisture-absorbing resin composition. The moisture-absorbing resin composition exhibits high moisture absorbency, high moisture absorption rate, and adhesion, and the molded product is produced from the composition.