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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9205594 B1

PDFFull Text
Date of Patent:
Dec. 08, 2015

Filed:

Apr. 22, 2013

Method for producing patterned materials

Applicant:

Liquidia Technologies, Inc., Morrisville, NC (US);

Inventors:

Alexander Ermochkine, Chapel Hill, NC (US);

Derek Schorzman, Cary, NC (US);

Jacob Sprague, Chapel Hill, NC (US);

Assignee:

Liquidia Technologies, Inc., Morrisville, NC (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Atul P Khare

Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 35/08 (2006.01); B29C 43/00 (2006.01); B29C 43/02 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); B32B 27/00 (2006.01); B29C 35/02 (2006.01); B29C 37/00 (2006.01); B29C 43/06 (2006.01); B29C 43/14 (2006.01); B29K 105/00 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 35/0894 (2013.01); B29C 43/003 (2013.01); B29C 43/021 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); B29C 35/0266 (2013.01); B29C 37/0053 (2013.01); B29C 43/06 (2013.01); B29C 59/022 (2013.01); B29C 2035/0827 (2013.01); B29C 2043/023 (2013.01); B29C 2043/025 (2013.01); B29C 2043/142 (2013.01); B29C 2059/023 (2013.01); B29C 2791/001 (2013.01); B29K 2105/0002 (2013.01); G02F 1/13336 (2013.01); Y10T 428/19 (2015.01); Y10T 428/192 (2015.01);
Abstract

A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.

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