The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Jul. 22, 2011
Applicants:
Srinivasan Sridharan, Strongsville, OH (US);
Robert P. Blonski, North Royalton, OH (US);
Chandrashekhar Khadilkar, Broadview Heights, OH (US);
John J. Maloney, Solon, OH (US);
Inventors:
Srinivasan Sridharan, Strongsville, OH (US);
Robert P. Blonski, North Royalton, OH (US);
Chandrashekhar Khadilkar, Broadview Heights, OH (US);
John J. Maloney, Solon, OH (US);
Assignee:
Ferro Corporation, Mayfield Heights, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 1/19 (2006.01); H01L 23/10 (2006.01); H01L 31/048 (2014.01); H01L 31/18 (2006.01); H05K 13/00 (2006.01); B23K 1/00 (2006.01); H01G 9/20 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
B23K 1/19 (2013.01); B23K 1/0016 (2013.01); B23K 31/02 (2013.01); H01L 23/10 (2013.01); H01L 31/048 (2013.01); H01L 31/0488 (2013.01); H01L 31/18 (2013.01); H05K 13/00 (2013.01); H01G 9/2077 (2013.01); H01L 51/5246 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12044 (2013.01); Y02E 10/50 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1062 (2015.01);
Abstract
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.