The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Nov. 07, 2013
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Hsiao-Yen Lee, Taipei, TW;

Yu-Yang Chang, Hsinchu County, TW;

Pao-Ming Tsai, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/28 (2006.01); G06F 1/16 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); G06F 1/1652 (2013.01); H01L 51/5246 (2013.01); H01L 2251/5338 (2013.01); Y10T 29/49888 (2015.01);
Abstract

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device. A manufacturing method of an environmental sensitive electronic device package is also provided.


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