The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

May. 25, 2009
Applicants:

Andrea Baccini, Treviso, IT;

Marco Galiazzo, Padua, IT;

Inventors:

Andrea Baccini, Treviso, IT;

Marco Galiazzo, Padua, IT;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H05K 3/12 (2006.01); B41F 15/08 (2006.01); B41F 15/20 (2006.01); H01L 21/67 (2006.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1216 (2013.01); B41F 15/0818 (2013.01); B41F 15/20 (2013.01); H01L 21/67259 (2013.01); H01L 31/022425 (2013.01); H01L 31/18 (2013.01); H01L 31/1876 (2013.01); B41P 2215/10 (2013.01); B41P 2215/114 (2013.01); B41P 2233/52 (2013.01); H05K 3/0097 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/09918 (2013.01); H05K 2203/163 (2013.01); Y02E 10/50 (2013.01);
Abstract

Embodiments of the invention generally provide apparatus and methods of screen printing a pattern on a substrate. In one embodiment, a patterned layer is printed onto a surface of a substrate along with a plurality of alignment marks. The locations of the alignment marks are measured with respect to a feature of the substrate to determine the actual location of the patterned layer. The actual location is compared with the expected location to determine the positional error of the patterned layer placement on the substrate. This information is used to adjust the placement of a patterned layer onto subsequently processed substrates.


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