The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Apr. 24, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hiromitsu Takashita, Osaka, JP;

Tsuyoshi Takeda, Osaka, JP;

Yuko Konno, Tokyo, JP;

Hiroaki Fujiwara, Nara, JP;

Shingo Yoshioka, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H05K 3/36 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/10 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H01L 21/563 (2013.01); H01L 23/49811 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H05K 3/368 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2223/6605 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16104 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16112 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32104 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32147 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/30111 (2013.01); H01L 2924/381 (2013.01); H01L 2924/3841 (2013.01); H05K 1/112 (2013.01); H05K 1/114 (2013.01); H05K 3/323 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09245 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09427 (2013.01);
Abstract

The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.


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