The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
May. 20, 2014
Applicant:
Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;
Inventors:
Kyung Min Kim, Hwaseong-si, KR;
Byung Seo Yoon, Hwaseong-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); G02F 1/1335 (2006.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); G02F 1/133603 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/502 (2013.01); H01L 33/52 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/0083 (2013.01); H01L 2933/0091 (2013.01);
Abstract
Provided are a light emitting diode package and a backlight assembly including the light emitting diode package. The light emitting diode package may comprise a package main body including a cavity; a light emitting diode (LED) chip positioned in the cavity; a lead frame installed in the package main body, positioned in the cavity at least partly, electrically connected to the light emitting diode chip mounted on the lead frame, and having one surface having a diffusion reflective layer thereon.