The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9202842 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 01, 2015

Filed:

Dec. 05, 2012
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masatsugu Itahashi, Yokohama, JP;

Kenji Togo, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 27/146 (2006.01); H01L 27/01 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14685 (2013.01); H01L 27/14689 (2013.01); H01L 27/14612 (2013.01);
Abstract

A method for manufacturing a conversion device is provided. Formed are an insulating layer that covers at least conversion portion is formed; a protection layer for suppressing formation of a metal-semiconductor compound layer, at a position where the protection layer covers the conversion portion via the insulating layer, covers at least part of an element isolation region, and exposes a transistor; and a metal film on the protection layer and the transistor. A metal-semiconductor compound layer on the transistor by performing heating process is formed. Metal that has not been reacted by the heating process is removed from the substrate. After that, an upper side in portions of the protection layer covering the conversion portion and the at least part of the element isolation region are removed.


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