The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Sep. 18, 2014
Applicant:
Omnivision Technologies (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Jiaming Xing, Shanghai, CN;
Jing Ye, Shanghai, CN;
Xifeng Gao, Shanghai, CN;
Zhetian Shi, Shanghai, CN;
Assignee:
OMNIVISION TECHNOLOGIES (SHANGHAI) CO., LTD., Shanghai, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/768 (2006.01); H01L 21/28 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 27/14625 (2013.01); H01L 21/28132 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 24/83 (2013.01);
Abstract
A method of fabricating a semiconductor structure is disclosed, in which a pad above a connecting section and metal structures above a functional section are formed from the same metal layer. This design enables the simultaneous formation of the pad and the metal structures by forming a single metal layer and performing thereon a selective etching process, thereby leading to the advantages of process simplification, throughput improvement and cost reduction.