The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Jul. 11, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Tao Hong, Soest, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 24/89 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7511 (2013.01); H01L 2224/7532 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/83054 (2013.01); H01L 2224/83055 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83093 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83222 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); Y10T 29/49117 (2015.01); Y10T 156/10 (2015.01);
Abstract

A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part, a connecting means and a sealing means. The connecting means is arranged in the first chamber region. The loaded pressure chamber is placed into a receiving region. The first housing element is pressed against the second housing element so that the pressure chamber is clamped with the aid of a working cylinder between the working cylinder and a holding frame. In the clamped state, a second gas pressure, which is higher than a first gas pressure in the first chamber region, is generated in the second chamber region. In this way, the first part, the second part and the connecting means are pressed against one another within the pressure chamber.


Find Patent Forward Citations

Hong, Tao. (2015). Methods for producing a bond and a semiconductor module (U.S. Patent No. 9202800). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9202800

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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