The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Mar. 05, 2010
Applicant:

Hideki Kitada, Kawasaki, JP;

Inventor:

Hideki Kitada, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/6835 (2013.01); H01L 23/481 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/838 (2013.01); H01L 2224/9202 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01059 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15788 (2013.01);
Abstract

A semiconductor device includes a first semiconductor substrate including a first integrated circuit, a second semiconductor substrate mounted over the first semiconductor substrate, the second semiconductor substrate including a second integrated circuit, a post made of an inorganic substance and formed over the first semiconductor substrate, an adhesive layer made of an organic substance arranged between the first and the second semiconductor substrates, and a substrate-through-via made of an electrical conductor extending through the second semiconductor substrate and the post, the substrate-through-via extending to the first semiconductor substrate.


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