The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9202702 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 01, 2015

Filed:

Apr. 13, 2012
Applicants:

Frederik Schrey, Leonberg, DE;

Achim Trautmann, Leonberg, DE;

Joachim Rudhard, Leinfelden-Echterdingen, DE;

Inventors:

Frederik Schrey, Leonberg, DE;

Achim Trautmann, Leonberg, DE;

Joachim Rudhard, Leinfelden-Echterdingen, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 21/285 (2006.01); H01L 21/768 (2006.01); H01L 21/04 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28506 (2013.01); H01L 21/7688 (2013.01); H01L 21/048 (2013.01); H01L 29/1608 (2013.01);
Abstract

A semiconductor device having a substrate, and at least one contact, situated on and/or above a surface of the substrate, having at least one layer made of a conductive material, the conductive material including at least one metal. The layer made of the conductive material is sputtered on, and has tear-off marks on at least one outer side area between an outer base area facing the surface and an outer contact area facing away from the surface. A manufacturing method for a semiconductor device having at least one contact is also described.


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