The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Nov. 15, 2012
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Han Soung Jeong, Suwon, KR;

Chang Hoon Kim, Suwon, KR;

Sang Hoon Kwon, Suwon, KR;

Seok Hyun Yoon, Suwon, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 7/00 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); C04B 35/468 (2006.01);
U.S. Cl.
CPC ...
H01G 4/12 (2013.01); C04B 35/468 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/782 (2013.01); C04B 2235/784 (2013.01); C04B 2235/785 (2013.01); Y10T 156/1092 (2013.01);
Abstract

There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.


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