The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Sep. 19, 2012
Applicant:

Daido Steel Co. Ltd., Nagoya-shi, JP;

Inventors:

Junichi Esaki, Nagoya, JP;

Yusuke Tozawa, Nagoya, JP;

Yoshitomo Kajinami, Nagoya, JP;

Kousuke Yoshimoto, Nagoya, JP;

Assignee:

DAIDO STEEL CO., LTD., Nagoya-Shi, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/02 (2006.01); H01F 27/255 (2006.01); H01F 1/26 (2006.01); H01F 37/00 (2006.01); B29C 45/00 (2006.01); H01F 41/12 (2006.01); H01F 1/147 (2006.01); H01F 27/22 (2006.01); H01F 27/28 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); B29C 45/0013 (2013.01); B29C 45/14 (2013.01); H01F 1/14766 (2013.01); H01F 1/26 (2013.01); H01F 27/02 (2013.01); H01F 27/22 (2013.01); H01F 27/2823 (2013.01); H01F 37/00 (2013.01); H01F 41/127 (2013.01); B29C 45/14639 (2013.01); B29C 45/1671 (2013.01); B29K 2995/0008 (2013.01); H01F 2017/048 (2013.01);
Abstract

[Problem] Provided is an injection-molded reactor which has a further reduced loss when the reactor is in operation. [Solution Means] The injection-molded reactor is configured by injection-molding a core using a compound for a core so that a coil obtained by winding a electric wire is embedded in the core without leaving any space therein, the compound being a compound obtained by adding a low-melting-point resin B that has a melting point of 150° C. or lower to a base resin A that is a highly heat-resistant resin with a melting point of 150° C. or higher and that accounts for most of thermoplastic resins forming a resin binder, the melting point of the low-melting-point resin B being lower than that of the base resin A, and mixing the base resin A and the low-melting-point resin B as the thermoplastic resins with a soft magnetic powder in a proportion represented by the following expression (1):·(soft magnetic powder)+(100−)·((100−)·(base resin)+Y·(low-melting-point resin))  expression (1)


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