The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Jan. 10, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Dylan J. Boday, Tucson, AZ (US);
Myron H. Gentrup, San Jose, CA (US);
Icko E. T. Iben, Santa Clara, CA (US);
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/40 (2006.01); G11B 5/60 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
G11B 5/40 (2013.01); G11B 5/6094 (2013.01); B82Y 30/00 (2013.01); H01L 2224/49175 (2013.01); Y10T 428/1164 (2015.01); Y10T 428/25 (2015.01); Y10T 428/2852 (2015.01);
Abstract
In one embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.