The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Feb. 10, 2015
Applicant:

Western Digital (Fremont), Llc, Fremont, CA (US);

Inventor:

Alexander V. Demtchouk, Sunnyvale, CA (US);

Assignee:

Western Digital (Fremont), LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/60 (2006.01); G11B 5/127 (2006.01); G11B 5/48 (2006.01); B23K 35/30 (2006.01); B23K 1/00 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/127 (2013.01); B23K 1/0008 (2013.01); B23K 35/3013 (2013.01); G11B 5/4866 (2013.01); G11B 5/60 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A head and a method to manufacture a head are disclosed. A slider is provided and has a mounting face that is opposite but substantially parallel to its air bearing surface. According to an example embodiment, a first plurality of layers may be deposited on the mounting face, including a tin layer, a first underlayer that comprises platinum, and an interface layer disposed between the first underlayer and the tin layer. The interface layer may comprise Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A submount with an attached laser diode may include a gold layer and be positioned adjacent to the first plurality of layers. The tin layer may then be melted so that the gold layer is dissolved therein, upon solidification attaching the submount to the mounting face by a solder layer that preferably comprises at least 45% gold by weight dissolved in tin.


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