The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Sep. 26, 2013
Applicant:

Fujifilm Corporation, Minato-ku, Tokyo, JP;

Inventors:

Satoshi Wakamatsu, Shizuoka-ken, JP;

Takeshi Unemura, Shizuoka-ken, JP;

Kenichi Kodama, Shizuoka-ken, JP;

Takafumi Noguchi, Shizuoka-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); G06F 17/50 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G06F 17/5009 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01);
Abstract

A simulation method predicts wet spreading and unions of a plurality of droplets arranged on a patterned surface defined by a fine pattern of protrusions and recesses, the patterned surface causing anisotropy to occur in the wet spreading of the droplets. The influence imparted by the pattern of protrusions and recesses that defines the patterned surface, which is the target of analysis, on the wet spreading of the droplets is treated as wetting properties of an analysis surface, and the wet spreading and unions of the plurality of droplets on the analysis surface are analyzed by gas liquid two phase flow analysis that incorporates the wetting property parameters that represents the wetting properties.


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