The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Oct. 09, 2012
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuki Nakagawa, Utsunomiya, JP;

Noriyasu Hasegawa, Utsunomiya, JP;

Yosuke Murakami, Utsunomiya, JP;

Takahiro Matsumoto, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41F 23/04 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

An imprint method of transferring a pattern formed on a mold onto a resin on a substrate. The substrate is held on a holding surface by suction. A shape of a substrate-side pattern area pre-existing on the substrate is deformed. A resin on the pattern area is brought in contact with the mold. Positions of the pattern of the mold and of the pattern area are adjusted. The resin is cured and the mold is released from the resin in contact with the mold. A deformation force, which is greater than a maximum static frictional force acting between a rear surface of the substrate corresponding to the pattern area and the holding surface, is applied to the substrate. A suction force acting on the rear surface of the substrate corresponding to the pattern area in deforming is less than a suction force acting on the substrate in adjusting.


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