The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

May. 10, 2011
Applicants:

Kenta Tada, Ohtsu, JP;

Emi Kubo, Ohtsu, JP;

Yu Yamamoto, Ohtsu, JP;

Inventors:

Kenta Tada, Ohtsu, JP;

Emi Kubo, Ohtsu, JP;

Yu Yamamoto, Ohtsu, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08K 5/5415 (2006.01); C08K 7/00 (2006.01); G02B 5/00 (2006.01); G03B 9/00 (2006.01); C08L 79/08 (2006.01); C09D 179/08 (2006.01); C08G 73/14 (2006.01);
U.S. Cl.
CPC ...
G02B 5/003 (2013.01); C08G 73/14 (2013.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08L 79/08 (2013.01); C09D 179/08 (2013.01); G03B 9/00 (2013.01);
Abstract

An object of the present invention is to inexpensively manufacture a light-shielding film having excellent heat resistance and dimensional stability, having high light-shielding property and low glossiness and showing little variation in glossiness of the film. The present invention is to provide a light-shielding film containing a polyamide-imide resin, a black filler having average particle size of 0.01 to 1 μm and inorganic particles having average particle size of 0.1 to 10 μm, wherein content of the polyamide-imide resin is 55 to 91% by weight, content of the black filler is 1 to 10% by weight and content of the inorganic particles is 8 to 35% by weight in the light-shielding film.


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