The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9200190 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 01, 2015

Filed:

Feb. 13, 2012
Applicants:

Jason Eric Maxey, Spring, TX (US);

Ryan Matthew Van Zanten, Houston, TX (US);

Inventors:

Jason Eric Maxey, Spring, TX (US);

Ryan Matthew Van Zanten, Houston, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 8/00 (2006.01); G01N 3/12 (2006.01); G01N 15/08 (2006.01);
U.S. Cl.
CPC ...
C09K 8/00 (2013.01); G01N 3/12 (2013.01); G01N 15/08 (2013.01); G01N 2203/0025 (2013.01); G01N 2203/0284 (2013.01);
Abstract

Predicting subterranean formation damages from deformable additives in treatment fluids may include measuring exponential shear values for samples comprising a base fluid and at least one deformable additive. Then the relative pore plugging propensity of the deformable additives may be determined by comparing the exponential shear values or rheological values derived therefrom from either two or more deformable additives to each other or from one or more deformable additives to a pore plugging propensity scale.


Find Patent Forward Citations

Maxey, Jason. (2015). Methods relating to predicting subterranean formation damage from deformable additives (U.S. Patent No. 9200190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9200190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…