The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Mar. 15, 2013
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Junbo Gao, Irvine, CA (US);
Gina Hoang, Garden Grove, CA (US);
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); H01B 1/22 (2006.01); C09J 9/02 (2006.01); C09J 163/00 (2006.01); C08G 59/18 (2006.01); C08G 73/12 (2006.01); C09J 179/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08G 59/182 (2013.01); C08G 73/124 (2013.01); C08G 73/125 (2013.01); C08G 73/126 (2013.01); C08G 73/127 (2013.01); C09J 163/00 (2013.01); C09J 179/085 (2013.01);
Abstract
A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.