The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Oct. 30, 2012
Applicant:
Kao Corporation, Tokyo, JP;
Inventors:
Assignee:
KAO CORPORATION, Toyko, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/07 (2006.01); B22C 1/22 (2006.01); C08K 5/1535 (2006.01); C08K 3/00 (2006.01); C08K 5/13 (2006.01);
U.S. Cl.
CPC ...
C08K 5/1535 (2013.01); B22C 1/2253 (2013.01); C08K 3/00 (2013.01); C08K 5/07 (2013.01); C08K 5/13 (2013.01);
Abstract
Disclosed is a binder composition for mold formation including: one or more 5-position substituted furfural compounds selected from the group consisting of 5-hydroxymethylfurfural and 5-acetoxymethylfurfural; and a furfurylated urea resin. The content of the 5-position substituted furfural compound(s) in the binder composition for mold formation is preferably from 1 to 30% by weight, and the content of the furfurylated urea resin is preferably from 1 to 20% by weight.