The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Feb. 21, 2012
Applicants:

Päivi Määttä, Lappila, FI;

Olavi Pirttiniemi, Järvelä, FI;

Johanna Lindén, Lappeenranta, FI;

Inventors:

Päivi Määttä, Lappila, FI;

Olavi Pirttiniemi, Järvelä, FI;

Johanna Lindén, Lappeenranta, FI;

Assignee:

Delight Packaging Oy, Imatra, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B65D 1/24 (2006.01); B65D 1/34 (2006.01); B29D 22/00 (2006.01); B65D 1/40 (2006.01); B31B 1/00 (2006.01); B29K 711/12 (2006.01);
U.S. Cl.
CPC ...
B65D 1/24 (2013.01); B29C 45/14 (2013.01); B29C 45/14336 (2013.01); B29D 22/003 (2013.01); B31B 1/00 (2013.01); B65D 1/34 (2013.01); B65D 1/40 (2013.01); B29K 2711/12 (2013.01); B31B 2201/223 (2013.01); B31B 2201/621 (2013.01);
Abstract

The disclosure concerns a package () comprising a cardboard blank (), the cardboard blank () being shaped as a container with a bottom () and one or more cardboard sidewalls () extending upwardly from the bottom (), the package () further comprising a molded rim () being attached to said one or more cardboard sidewalls (), along an interface (I) formed of an upper portion of said one or more cardboard sidewalls () and a lower portion of said molded rim (), and extending along at least a part of an upper edge of said one or more cardboard sidewalls (), characterised in that the rim () is extending essentially upright upwardly from said one or more cardboard sidewalls () thereby providing the package () with a molded upper sidewall portion. The disclosure also concerns a method and a molding tool.


Find Patent Forward Citations

Loading…