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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9199434 B1

PDFFull Text
Date of Patent:
Dec. 01, 2015

Filed:

Apr. 28, 2014

Resin composition, prepreg and their uses

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Kenichi Mori, Tokyo, JP;

Syouichi Itoh, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Robert Sellers

Int. Cl.
CPC ...
B32B 15/092 (2006.01); C08L 71/12 (2006.01); C08G 65/44 (2006.01); C08G 65/48 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); B32B 17/04 (2006.01); B32B 27/04 (2006.01); C08K 3/36 (2006.01); C08K 5/3415 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
B32B 15/092 (2013.01); C08G 65/44 (2013.01); C08G 65/485 (2013.01); C08J 5/24 (2013.01); C08L 71/126 (2013.01); H05K 1/036 (2013.01); H05K 1/0353 (2013.01); H05K 1/0366 (2013.01); H05K 1/056 (2013.01); C08J 2363/00 (2013.01); C08K 5/3415 (2013.01); C08L 63/00 (2013.01); Y10T 428/31511 (2015.04); Y10T 428/31522 (2015.04); Y10T 428/31529 (2015.04); Y10T 442/2934 (2015.04); Y10T 442/30 (2015.04); Y10T 442/3415 (2015.04); Y10T 442/3423 (2015.04);
Abstract

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

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