The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Jul. 15, 2011
Applicants:

Hae-won Ahn, Gyeongsangbuk-do, KR;

Jae-ho OH, Gyeongsangbuk-do, KR;

Jeong-woon Koo, Gyeongsangbuk-do, KR;

Inventors:

Hae-Won Ahn, Gyeongsangbuk-do, KR;

Jae-Ho Oh, Gyeongsangbuk-do, KR;

Jeong-Woon Koo, Gyeongsangbuk-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/40 (2006.01); B29C 45/14 (2006.01); H01Q 1/24 (2006.01); B29C 45/00 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14639 (2013.01); B29C 45/14065 (2013.01); H01Q 1/243 (2013.01); B29C 45/006 (2013.01); B29C 45/14311 (2013.01); B29C 45/14778 (2013.01); B29C 2045/14327 (2013.01); B29K 2705/00 (2013.01); B29L 2031/3431 (2013.01); B29L 2031/3456 (2013.01); B29L 2031/3481 (2013.01);
Abstract

An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.


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