The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Jan. 20, 2006
Applicants:

Masahiro Kihara, Fukuoka, JP;

Masafumi Inoue, Saga, JP;

Wataru Hidese, Fukuoka, JP;

Inventors:

Masahiro Kihara, Fukuoka, JP;

Masafumi Inoue, Saga, JP;

Wataru Hidese, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 13/04 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0413 (2013.01); H05K 13/0069 (2013.01); Y10T 29/49004 (2015.01); Y10T 29/53174 (2015.01);
Abstract

An electronic component mounting system mounts an electronic component on a substrate to manufacture a mounting substrate, and can prevent a mounting failure due to a positional error in a height direction of a substrate and ensure mounting quality. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrateby a height measuring machineand outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing headis updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.


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