The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
May. 24, 2013
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Min-Su Chang, Incheon, KR;
Soon-Ho Han, Gyeonggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 13/00 (2006.01); B44C 5/04 (2006.01); B44F 9/10 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); B29C 37/00 (2006.01); B29C 45/14 (2006.01); B29C 45/37 (2006.01); H04M 1/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0084 (2013.01); B29C 37/0032 (2013.01); B29C 37/0053 (2013.01); B29C 45/14827 (2013.01); B29C 45/372 (2013.01); B44C 5/0453 (2013.01); B44F 9/10 (2013.01); H05K 5/0217 (2013.01); H05K 5/03 (2013.01); B29C 37/0067 (2013.01); B29C 2037/0042 (2013.01); B29L 2031/3481 (2013.01); H04M 1/0249 (2013.01); H04M 1/0283 (2013.01);
Abstract
A method for processing a housing for devices such as electronic devices. A hairline is formed on an inner surface of an inmold mold. In addition, a hairline is formed on an inmold film. The inmold film is positioned inside the inmold mold and a housing representing the hairline of the inmold mold and the hairline of the inmold film together is formed using inmold injection molding.