The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Apr. 29, 2013
Applicant:

Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;

Inventors:

Yoshinori Sunaga, Hitachinaka, JP;

Yoshiaki Ishigami, Hitachi, JP;

Hidetaka Kawauchi, Hitachi, JP;

Hidenori Yonezawa, Hitachi, JP;

Kinya Yamazaki, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); G06F 1/20 (2006.01); H04B 1/036 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); G06F 1/20 (2013.01); H04B 1/036 (2013.01); H05K 1/141 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10553 (2013.01);
Abstract

A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.


Find Patent Forward Citations

Loading…