The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Sep. 11, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Nobuo Ikemoto, Nagaokakyo, JP;

Atsushi Kumano, Nagaokakyo, JP;

Jerry Hsieh, Nagaokakyo, JP;

Jun Sasaki, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H05K 1/18 (2006.01); H01L 27/146 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H05K 1/182 (2013.01); H01L 27/14618 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0298 (2013.01); H05K 1/185 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer and on which the image sensor IC is mounted, and a via-hole conductor electrically connected to the mounting electrode. The resin multilayer board includes a flat plate portion including a surface on which the mounting electrode is mounted, and a rigid portion including a greater number of thermoplastic resin layers than that of the flat plate portion, and the via-hole conductor is arranged in the flat plate portion so as to avoid the thermoplastic resin layer on which the mounting electrode is stacked.


Find Patent Forward Citations

Ikemoto, Nobuo. (2015). Camera module (U.S. Patent No. 9197803). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9197803

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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