The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Oct. 31, 2013
Applicants:

Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Guo-Hua Duan, Shenzhen, CN;

Fu-Chun Li, Shenzhen, CN;

Yong Li, Shenzhen, CN;

Yu-Shu Lin, New Taipei, TW;

Shu-Sheng Peng, Shenzhen, CN;

Wen-Hsiung Chen, New Taipei, TW;

Shin-Wen Chen, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2253 (2013.01); H04N 5/2252 (2013.01); H04N 5/2257 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.


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