The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Feb. 19, 2013
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Tsutomu Nishiwaki, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 11/00 (2006.01); H01L 41/47 (2013.01); B06B 1/06 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
H04B 11/00 (2013.01); B06B 1/0629 (2013.01); H01L 41/0475 (2013.01);
Abstract

An ultrasonic transducer device includes a substrate, a plurality of ultrasonic transducer elements, a wiring substrate and a wiring member. The substrate defines a plurality of openings arranged in an array pattern. Each of the ultrasonic transducer elements is provided in each of the openings on a first surface of the substrate. The wiring substrate is arranged to face a second surface of the substrate that is opposite from the first surface. The wiring substrate includes a first wiring part. The wiring member is connected to the substrate and the wiring substrate. The wiring member includes a second wiring part electrically connecting the ultrasonic transducer elements to the first wiring part.


Find Patent Forward Citations

Loading…