The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Aug. 17, 2011
Applicants:

Hyun Tae Kim, Suwon-si, KR;

Tae Sang Park, Seoul, KR;

Young Jun Moon, Hwaseong-si, KR;

Soon Min Hong, Seoul, KR;

Inventors:

Hyun Tae Kim, Suwon-si, KR;

Tae Sang Park, Seoul, KR;

Young Jun Moon, Hwaseong-si, KR;

Soon Min Hong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H05K 13/00 (2006.01); H01R 43/24 (2006.01);
U.S. Cl.
CPC ...
H01R 43/24 (2013.01); Y10T 29/49147 (2015.01);
Abstract

Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.


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