The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Jul. 27, 2012
Applicants:

Jee Heum Paik, Seoul, KR;

Sang Ki Cho, Seoul, KR;

Inventors:

Jee Heum Paik, Seoul, KR;

Sang Ki Cho, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/54 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/92247 (2013.01); H01L 2933/005 (2013.01);
Abstract

Provided are an optical device package and a method of manufacturing the same. The method of manufacturing the optical device package according to an exemplary embodiment of the present invention comprises: forming a metal layer on an insulating layer on which via holes are formed; forming a circuit pattern layer by etching the metal layer; forming a boundary part in a predetermined part of the metal layer; mounting an optical device on the circuit pattern layer; and forming a molding part by applying a transparent material to the optical device, wherein the predetermined part is a part corresponding to a boundary of the molding part.


Find Patent Forward Citations

Loading…